Biography

Bangqi Fu is currently a Ph.D. student at The Chinese University of Hong Kong supervised by Prof. Evangeline F.Y. Young. Before that, he graduated with B.S.E from Shanghai Jiao Tong University in 2021. His research interests focus on VLSI physical synthesis with GPU acceleration and machine Learning.

Publications

    Conference

  1. Bangqi Fu, Lixin Liu, Qijing Wang, Yutao Wang, Martin D. F. Wong, and Evangeline F. Y. Young, "Fast Dynamic IR-Drop Prediction with Dual-path Spatial-Temporal Attention", In 2025 IEEE/ACM Design, Automation and Test in Europe Conference (DATE '2025) [paper] [code]
  2. Bangqi Fu, Lixin Liu, Martin D. F. Wong, and Evangeline F. Y. Young, "Hybrid Modeling and Weighting for Timing-driven Placement with Efficient Calibration", In 2024 IEEE/ACM International Conference On Computer Aided Design (ICCAD '2024) [paper] [code]
  3. Bangqi Fu, Lixin Liu, Yang Sun, Wing-Ho Lau, Martin D. F. Wong, and Evangeline F. Y. Young, "CoPlace: Coherent Placement Engine with Layout-aware Partitioning for 3D ICs", In 2024 IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC '2024) (Best Paper Award Nomination)[paper]
  4. Fangzhou Wang, Qijing Wang, Bangqi Fu, Shui Jiang, Xiaopeng Zhang, Lilas Alrahis, Ozgur Sinanoglu, Johann Knechtel, Tsung-Yi Ho, and Evangeline F.Y. Young, "Security Closure of IC Layouts Against Hardware Trojans", In 2023 International Symposium on Physical Design (ISPD '2023)
  5. Lixin Liu, Bangqi Fu, Martin D. F. Wong, and Evangeline F. Y. Young, "Xplace: an extremely fast and extensible global placement framework", In 59th ACM/IEEE Design Automation Conference (DAC '2022) [code]
  6. Zhuoran Song, Bangqi Fu, Feiyang Wu, Zhaoming Jiang, Li Jiang, Naifeng Jing, Xiaoyao Liang, "DRQ: Dynamic Region-based Quantization for Deep Neural Network Acceleration", In 2020 ACM/IEEE 47th Annual International Symposium on Computer Architecture (ISCA '2020)
  7. Journal

  8. Lixin Liu, Bangqi Fu, Shiju Lin; Jinwei Liu, Evangeline F. Y. Young and Martin D. F. Wong, "Xplace: An Extremely Fast and Extensible Placement Framework", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD '2023) [code]

Selected Honors and Awards

Updated on May 09, 2025.